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Creep Behavior of Hexply 8552 Prepregnated ...
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Creep Behavior of Hexply 8552 Prepregnated Fiberglass-Epoxy
Creep Behavior of Hexply 8552 Prepregnated Fiberglass-Epoxy
Name:Personal
Eric Jensen Role :Text(marcrelator)
creator
Eric Jensen Role :Text(marcrelator)
creator
Name:Personal
Dr. David Walrath Role :Text(marcrelator)
creator
Dr. David Walrath Role :Text(marcrelator)
creator
typeOfResource
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Powerpoint/PDF
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Place
Laramie, Wyoming
University of Wyoming (keyDate="yes")
4/24/2010
Laramie, Wyoming
University of Wyoming (keyDate="yes")
4/24/2010
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born digital
abstract
It has been shown that fiberglass will deform over time under a constant stress. However, different fiberglass weaves and resins react differently under the same conditions. For these reasons Hexply 8552 prepregnated fiberglass-epoxy was studied to determine creep behavior. Test specimens were created and then subjected to 20, 40, 50, 75, and 100 ksi tensile stresses. Each stress was applied for ten minutes, and then removed for ten minutes, and then the next stress was applied. Strain was measured using an extensometer. The results showed minimal creep behavior. This suggests that the measurement resolution was not high enough to accurately measure creep behavior in that amount of time. To try to extend the testing time specimens were subjected to a 20 ksi stress for one hour and then given an hour to rest and recover at 25, 50, and 75 degrees Fahrenheit. The intent was to use the time-temperature superposition principle to create a master curve. Unfortunately, the measurement resolution was still insufficient. So a new shunt calibration system was created to increase measurement resolution and it was concluded that more long term tests are needed to find a relationship between stress, time under load, and deformation. note
From - Undergraduate Research Day 2010 - Celebration of Research - Abstracts
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Undergraduate Research Day
Undergraduate Research Day
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Undergraduate Research Day 2010
Undergraduate Research Day 2010
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http://hdl.handle.net/10176/wyu:714
http://hdl.handle.net/10176/wyu:714
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